The hybrid ARM + FPGA chip can get very hot when running certain MiSTer cores, even in menu core some passive cooling is required. The main heat source in the chip is the integrated dual-core ARM producing a constant heat regardless of the FPGA core use.
The solution is installation of a quality heat sink, just installing this heat sink adds much improved passive cooling for your MiSTer FPGA setup, however pair this with a MiSTer IO Board and a mounted fan and you will have the best active cooling solution possible.
✅ Suitable For Terasic DE10-Nano FPGA Board
✅ 3M 8810 Thermal Conductive Adhesive Applied
✅ Improve FPGA Passive Cooling
✅ MiSTer IO Board Compatible
✅ Black Aluminium 6063-T5
Mike May –
Perfect fitting heatsink for the Cyclone V on the MiSTer / DE10 Nano, good quality.