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MiSTer DE10 Nano Terasic Cooling Heat Sink


High quality all metal heatsink for the MiSTer FPGA Terasic DE10-Nano board with 3M 8810 thermal conductive adhesive applied for quick and easy mounting on the DE10-Nano.

(1 customer review)

9 in stock (can be backordered)

The hybrid ARM + FPGA chip can get very hot when running certain cores, even in menu core some passive cooling is required. The main heat source in the chip is the integrated dual-core ARM producing a constant heat regardless of the FPGA core use.

The solution is installation of a quality heat sink, just installing this heat sink adds much improved passive cooling for your MiSTer setup, however pair this with a MiSTer IO Board and a mounted fan and you will have the best active cooling solution possible.

✅ Suitable For Terasic Technologies DE10-Nano FPGA Board
✅ 3M 8810 Thermal Conductive Adhesive Applied
✅ Improve FPGA Passive Cooling
✅ MiSTer IO Board Compatible
✅ Black Aluminium

  1. Mike May

    Perfect fitting heatsink for the Cyclone V on the MiSTer / DE10 Nano, good quality.

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SKU: MiSTer-Metal-Heatsink Category: Tags: ,
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